Guangdong, China
Business Type:
Manufacturer/Factory, Trading Company
Business Range:
Agriculture & Food, Chemicals, Electrical & Electronics, Health & Medicine, Industrial ...
Plant Area:
501~1000 square meters
Management System Certification:
ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000
OEM/ODM Availability:
Yes
OEM/ODM Service
Sample Available

Cts Equipment, Screen Making Machine, Cts Making System manufacturer / supplier in China, offering PCB Pre-Press UV Laser Direct Imaging Machine (LDI Equipment), Factory Sale Mealworm Screening Machine Superworm Screening Machine, Small Centrifugal Type Defoaming Ink Mixing Machines Widly Apply to Material Factory and Laboratory and so on.

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Supplier Homepage Products Pre Press Related Equipments PCB Pre-Press UV Laser Direct Imaging Machine (LDI Equipment)
  • PCB Pre-Press UV Laser Direct Imaging Machine (LDI Equipment)
  • PCB Pre-Press UV Laser Direct Imaging Machine (LDI Equipment)
  • PCB Pre-Press UV Laser Direct Imaging Machine (LDI Equipment)
  • PCB Pre-Press UV Laser Direct Imaging Machine (LDI Equipment)
  • PCB Pre-Press UV Laser Direct Imaging Machine (LDI Equipment)

PCB Pre-Press UV Laser Direct Imaging Machine (LDI Equipment)

Min. Order / Reference FOB Price
1 Set US $115,000/ Set
Port: Shenzhen, China
Production Capacity: 100set/Year
Payment Terms: T/T
Usage: Silkscreen Printing
Plate: Porous Printing
Type: Laser Plate Making Machine
Material / Metal Processed: Stainless Steel
Classification: Flat Type
Light Source: Solid State Laser

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Basic Info.

Model NO.
SBT-JG1210
Certification
CE, ISO
Maximum Frame Size
1200 X 2000 mm
Minimum Frame Size
300 X 300 mm
Frame Thickness
20-40mm
Laser Unit
8W / 12W
Trademark
subit
Transport Package
Wooden Case
Specification
3000*1850*1700mm
Origin
China
HS Code
8442302100
High precision screen computer direct plate making system

It adopts the industry-leading purple laser technology, adopts the DMD core components of American TI Company, cooperates with high-power 405nm laser module, high-precision linear motor motion system and stable water cooling system. It can directly expose high precision on the surface of traditional wire mesh, eliminating the need for film.Bring high resolution, high efficiency and low cost products to customers. This latest digital exposure system will become the new standard in the industry.

PCB Pre-Press UV Laser Direct Imaging Machine (LDI Equipment)

Equipment introduction:
High power UV laser
Unique way of using the light source, we use the 32-way beam-combining technology to ensure the total power, and it will not be difficult to stop due to a few problems. The laser diode analog output brings more stable energy. The laser diode is only in the When the exposure is turned on, the utilization rate of the laser module is increased, and the water circulation cooling system ensures that the inside of the machine is kept at a constant temperature of 22 degrees to ensure the stability of the laser.
12700dpi, 25400dpi high resolution
With a data resolution of 12,700 dpi and 25,400 dpi, it is easy to express 60 micron or finer lines (laser equipment with an accuracy of 5 UM) while exhibiting sharp curves and radians.

PCB Pre-Press UV Laser Direct Imaging Machine (LDI Equipment)


Direct making plate application field
Because direct plate making machines are fully integrated into traditional processes, most areas of traditional silk screens can be used. For example: glass cover, touch screen (TP), ceramic printing, commercial silk screen, glass printing, PCB circuit board characters.


Advantage summary for Laser direct imaging(LDI):

 
1)no film/mask required
LDI can eliminate the use of photomasks, greatly simplify the process of image transfer, and effectively save production costs.
2)Good small linewidth resolution
LDI is a projection exposure technology that achieves the same level of resolution as conventional semiconductor exposure systems.
3)Excellent alignment ability
LDI technology uses digital imaging, data can be changed in the drawing operation, and the graphic positioning is more accurate.
Effectively solve problems such as irregularity of material expansion and contraction
4)Image transfer on uneven surfaces.
LDI equipment has a good focus depth to minimize the limits of image changes.

Linear Motor
High-precision A0-class guide rails with high-strength and stable linear motors are the key to long-term, stable and high-intensity operation of the machine.
Dynamic focus system
High-precision, high-response dynamic real-time focusing is the key technology for perfect exposure. Our dynamic response time is 0.1ms, the motor tracking acceleration is 2m/s, and the dynamic focus is 3 microns, the focus range is +/- 4mm. Only these are in real-time conditions to ensure the surface of the screen. There will be no seam problems when exposed.

PCB Pre-Press UV Laser Direct Imaging Machine (LDI Equipment)

Technical Parameters:
ModelSBT-JG1210
Maximum frame size1200 x 2000 mm
Minimum frame size300 x 300 mm
Frame thickness 20-40mm
Imaging System TechnologyDMD XGA
Laser unit8W / 12W
Wavelength 405nm
Focal lengthautomatic focal length control system
Data resolution 12700dpi
Photosensitive adhesive thickness2 - 50 microns
Minimum line width 60 microns
Data interface Ethernet
File formatGerber 274-x
Exposure speed12 pph, 1000 x 800 mm (depending on the sensitivity and thickness of the photoresist)
Equipment size 2950 x 1800 x 1650 mm
Net weight of equipment2600KG
Working conditions 18-26 degrees Celsius 40-70% relative humidity Compressed air
Power supplySingle phase 220V, 50/60 Hz, 4Kw

Exporting packing:
PCB Pre-Press UV Laser Direct Imaging Machine (LDI Equipment)

After sale service:

1)The first year of the manufacturer's free warranty maintenance. The main components of the machine have been used by customers for 4 years without any problems. Follow-up and convenient maintenance solutions ensure low cost and reliability. Experienced after-sales service personnel, equipment maintenance guarantees reliable.
2) if one site service is required after 1 year, customer shall supply engineering personal round trip fares and accommodation expense.




 

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